The wearable rage is catching up and when Tim Cook was showcasing the first wearable from the Cupertino Giant, Intel was also talking about wearable at the Intel Developer Forum on Tuesday.
43 miles away when Apple was introducing its next generation of iPhone and iwatch, Intel’s chief executive was also showing off wearable. It included wearable created by Intel as well as those created by its partners. Intel’s CEO also said that the next generation wearable from its Basis group will be shipped by 2014. The wearable will be thinner, have a better battery life and and also a better screen.
Kirk Skaugen, GM of Intel’s PC Client Group, demonstrated a desktop PC running on a Skylake chip and said the processor would deliver a significant increase in performance, battery life and power efficiency. It will be available to to developers in the first half of 2015.
Intel also announced that its Edison embedded processor, announced at CES, is ready for shipping. The latest chip architecture will be succeeding the just-launched Core M.
The crowning glory was the Dell Venue 8 7000 series Tablet which is due for launch in November. It will feature the revolutionary RealSense depth cameras built inside which integrates multiple cameras.This will allow user to manipulate images after they are taken by adjusting the focus on different image depths
The goal of Intel is to get a firm hold on a network of sensors which are appearing in the wearable. Intel already has a formidable presence in microprocessors from the data center out through the PC and not its processors will crunch the data obtained from the sensors on the wearable. The device market will swell to 50 billion devices, supplying 35 zettabytes of data by 2020. There will be a pressing need for data analytics and here the big and heavy server processors from Intel will come into play. Over 17 billion devices will comprise the Internet of Things and Intel hopes to use its Edison processor which combines computation with communication capabilities. A successor to the Quark embedded processor that Intel launched at last year at a developer conference, Edison uses a 22 nanometer process and it is now shipping at a price of $50.
Krzanich also talked about the commercial availability of the Intel XMM 7260 modem. It will be shipping in the Samsung Galaxy Alpha smartphone outside the U.S. Also on display was Intel’s Wireless Gigabit Docking technology, which includes wireless docking, wireless display and wireless charging via an Intel reference design.